Multi-chip module - max. 1066 Mbps | KA, K5 series
Teledyne e2v Completes First Multi-Chip Module Assembly on Organic Flip-ChipRelated ResourcesPopular PostsGaN-Based Devices for Advanced RF Applications Puts Technology Building Blocks in the SpotlightRF SOI Enables 5G mMIMO Active Antenna Systems5G Satellite Communications Market and Design TrendsFeatured VideosNew Cost-Effective mmWave Testing Solution from Copper Mountain Technologies and EravantWideband High Accuracy Butler Matrices 8-Channel Ku/CDL Band Tx Beamforming ICMW and RF Suspended Substrate Filters
アサヒ スーパードライ 缶(350ml*48本セット)【アサヒ スーパードライ】
thermal conduction module with direct solder attach cooling (disac) dual layer thermal interface material thermal designmcm with sgt technique with hermetic sealsummaryreferences
Chapter 2: Technologies for Electronics - Overview
Building Pixel Detector Modules in Multi Chip Module Deposited Technology