US6344684B1 - Multi-layered pin grid array interposer apparatus and method for testing semiconductor devices having a non-pin grid array footprint - Google PatentsFamily
LGA
SMR-MME 2017
【新品】iPhone 16 Pro 1TB ブラックチタニウム MYN83J/A SIMフリー
bga_leiterplatte_ball-grid-array
Sensata’s Thermal Test and Controls Business joins Boyd